Foundations of Materials Science and Engineering
Foundations of Materials Science and Engineering
6th Edition
ISBN: 9781259696558
Author: SMITH
Publisher: MCG
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Chapter 5.7, Problem 42SEP

Would you expect the diffusion rate of copper (self-diffusion) to be lower or higher in copper with ASTM grain size 4 than in copper with ASTM grain size 8? Explain your answer.

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Introduction to Diffusion in Solids; Author: Engineering and Design Solutions;https://www.youtube.com/watch?v=K_1QmKJvNjc;License: Standard youtube license