Operations Management
Operations Management
17th Edition
ISBN: 9781259142208
Author: CACHON, Gérard, Terwiesch, Christian
Publisher: Mcgraw-hill Education,
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Chapter 7, Problem 6PA

a)

Summary Introduction

To determine: The process capacity in units per hour with a batch size of 100 wafers.

b)

Summary Introduction

To determine: The utilization of depositing.

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JCL Inc. is a major chip manufacturing firm that sells its products to computer manufacturers like Dell, Gateway, and others. In simplified terms, chip making at JCL Inc. involves three basic operations: depositing, patterning, and etching. Depositing: Using chemical vapor deposition (CVD) technology, an insulating material is deposited on the wafer surface, forming a thin layer of solid material on the chip. Patterning: Photolithography projects a microscopic circuit pattern on the wafer surface, which has a light-sensitive chemical like the emulsion on photographic film. It is repeated many times as each layer of the chip is built. Etching: Etching removes selected material from the chip surface to create the device structures.   The table below lists the required processing times and setup times at each of the steps. There is unlimited space for buffer inventory between these steps. Assume that the unit of production is a wafer, from which individual chips are cut at a later…
JCL Inc. is a major chip manufacturing firm that sells its products to computer manufacturers like Dell, Gateway, and others. In simplified terms, chip making at JCL Inc. involves three basic operations: depositing, patterning, and etching. • Depositing: Using chemical vapor deposition (CVD) technology, an insulating material is deposited on the wafer surface, forming a thin layer of solid material on the chip. Patterning: Photolithography projects a microscopic circuit pattern on the wafer surface, which has a light-sensitive chemical like the emulsion on photographic film. It is repeated many times as each layer of the chip is built. • Etching: Etching removes selected material from the chip surface to create the device structures. The table below lists the required processing times and setup times at each of the steps. There is unlimited space for buffer inventory between these steps. Assume that the unit of production is a wafer, from which individual chips are cut at a later…
A Company produces a component for use in the aerospace industry. The component consists of three parts (A, B and C), which are purchased externally and cost 50c, 60c and 70c per piece respectively. Parts A and B are assembled first on assembly line 1, which produces 150 components per hour. Part C undergoes a drilling operation before being finally assembled with the output from assembly line 1. There are six drilling machines in total, but only three are currently operational. Each drilling machine drills part C at a rate of 30 parts per hour. The final assembly line has a production capacity of 100 components per hour. At present, components are produced eight hours a day, five days a week. If the need arises, management can add a second shift of eight hours for the assembly lines only. The cost of assembly labour is 40c per assembly operation for each assembly line; the cost of drilling labour is 20c per part. For drilling, the cost of electricity is 10c per part. The overhead cost…
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