Manufacturing Engineering & Technology
7th Edition
ISBN: 9780133128741
Author: Serope Kalpakjian, Steven Schmid
Publisher: Prentice Hall
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Textbook Question
Chapter 28, Problem 42SDP
Estimate the time required to etch a spur gear blank from a 75-mm thick slug of silicon.
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Chapter 28 Solutions
Manufacturing Engineering & Technology
Ch. 28 - Define the terms wafer, chip, die, device,...Ch. 28 - Why is silicon the semiconductor most used in...Ch. 28 - What do the abbreviations BJT, MOSFET, VLSI,...Ch. 28 - Prob. 4RQCh. 28 - Prob. 5RQCh. 28 - What are the purposes of prebaking and...Ch. 28 - Define selectivity and isotropy, and their...Ch. 28 - Prob. 8RQCh. 28 - Prob. 9RQCh. 28 - What are the levels of interconnection?
Ch. 28 - Which is cleaner, a Class-10 or a Class-1 clean...Ch. 28 - Prob. 12RQCh. 28 - What is a via? Why is it important?Ch. 28 - Describe how electrical connections are...Ch. 28 - Prob. 15RQCh. 28 - Prob. 16RQCh. 28 - Comment on your observations regarding the...Ch. 28 - Describe how n-type and p-type dopants differ.Ch. 28 - Prob. 19QLPCh. 28 - How is epitaxy different from other techniques...Ch. 28 - Note that, in a horizontal epitaxial reactor...Ch. 28 - The table that follows describes three...Ch. 28 - Prob. 23QLPCh. 28 - What is accelerated life testing? Why is it...Ch. 28 - Explain the difference between a die, a chip, anda...Ch. 28 - A common problem in ion implantation is...Ch. 28 - Examine the hole profiles shown in Fig. P28.27...Ch. 28 - Referring to Fig. 28.24, sketch the shape of the...Ch. 28 - Prob. 29QTPCh. 28 - Prob. 30QTPCh. 28 - Prob. 31QTPCh. 28 - A certain design rule calls for metal lines to be...Ch. 28 - Prob. 33QTPCh. 28 - If a square mask of side length 100 m is placed on...Ch. 28 - Obtain an expression for the width of the trench...Ch. 28 - Prob. 36SDPCh. 28 - Inspect various electronic and computer equipment,...Ch. 28 - Describe your understanding of the important...Ch. 28 - Make a survey of the necessity for clean rooms in...Ch. 28 - Prob. 40SDPCh. 28 - Prob. 41SDPCh. 28 - Estimate the time required to etch a spur gear...Ch. 28 - Prob. 43SDPCh. 28 - Review the specific devices, shown in Fig. V.2....
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- Write in detail following terminologies according to wafer fabrication processes: a. Diffusion and Ion Implantation b. Metallization c. Etchingarrow_forwarddon't provide chat gpt answer which I Already have.arrow_forwardExplain with neat sketch of “Etching” the surface finishing process.( Minimum 1 and half pages including diagram.) (Manufacturing Process)arrow_forward
- Describe the process of microchip manufacturing, including the use of photolithography and semiconductor materials.arrow_forwardDiscuss the evolution of microchip technology over the years, including advancements in miniaturization and performance.arrow_forwardANSWER THE FOLLOWING : Name one factor PCB fabricators consider when etching a design. Explain thoroughly (include images if applicable)arrow_forward
- (a) Summarise the applications of Additive Manufacturing & 3D Printing (AM3DP) and discuss the impacts of AM-3DP on the modern CAM systems, especially in the aspects of Rapid Manufacturing and Smart Manufacturing. (c) Summarise the methods and tools which are used for Design for Additive Manufacturing (DfAM).arrow_forward2. Explain with neat sketch of “Etching” the surface finishing process.( Minimum 1 and half pages including diagram.)arrow_forwardA metallic disc of 20 mm diameter is to be punched from a sheet of thickness 2 mm. Radial clearance is 3 % of sheet thickness. Find out the required punch size?arrow_forward
- Define what a microchip is and provide examples of its applications in various fields.arrow_forwardSOLVE STEP BY STEP IN DIGITAL FORMAT Investigate the use of advanced materials in aircraft design, such as composites or nanomaterials, and their potential benefits and limitations.arrow_forwardDiscuss the importance of microchip manufacturing processes such as photolithography and etching in producing advanced microchips.arrow_forward
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