Manufacturing Engineering & Technology
Manufacturing Engineering & Technology
7th Edition
ISBN: 9780133128741
Author: Serope Kalpakjian, Steven Schmid
Publisher: Prentice Hall
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Chapter 28, Problem 22QLP

The table that follows describes three wafer-manufacturing changes: increasing the wafer diameter, reducing the chip size, and increasing process complexity. Complete the table by filling in “increase,” “decrease,” or “no change,” and indicate the effect that each change would have on the wafer yield and on the overall number of functional chips.

Change Wafer yield Number of functional chips

Increase wafer diameter

Reduce chip size

Increase process complexity

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A siilicon boule has been processed through grinding to provide a cylinder whose diameter  = 281 mm and whose length = 899 mm. Next, it will be sliced into wafers 0.8 mm thick using a cut-off saw with a kerf = 0.5 mm. The wafer thus produced will be used to fabricate as many IC chips as possible for the personal computer market. Each IC has a market value to the company of $108. Each chip is square with 17 mm on a side. The processable area of each wafer is defined by a diameter = 265 mm. Estimate the value of all of the IC chips that could be produced (in $), asssuming an overall yield of 84% good product.

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