Manufacturing Engineering & Technology
7th Edition
ISBN: 9780133128741
Author: Serope Kalpakjian, Steven Schmid
Publisher: Prentice Hall
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Chapter 36, Problem 21QLP
To determine
Describe situations in which the need for destructive testing techniques is unavoidable.
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Chapter 36 Solutions
Manufacturing Engineering & Technology
Ch. 36 - Define the terms sample size, random sampling,...Ch. 36 - What are chance variations?Ch. 36 - Prob. 3RQCh. 36 - Define standard deviation. Why is it important...Ch. 36 - Describe what is meant by statistical process...Ch. 36 - When is a process out of control? Explain.Ch. 36 - Explain why control charts are developed. How...Ch. 36 - What is a loss function? How is it used?Ch. 36 - What do control limits indicate?Ch. 36 - Prob. 10RQ
Ch. 36 - What is acceptance sampling? Why was it developed?Ch. 36 - Prob. 12RQCh. 36 - What is meant by six-sigma quality?Ch. 36 - Prob. 14RQCh. 36 - Prob. 15RQCh. 36 - Give three methods of nondestructive testing...Ch. 36 - Explain why major efforts are continually being...Ch. 36 - Prob. 18QLPCh. 36 - Prob. 19QLPCh. 36 - Prob. 20QLPCh. 36 - Prob. 21QLPCh. 36 - Prob. 22QLPCh. 36 - What are the advantages of automated...Ch. 36 - Prob. 24QLPCh. 36 - Prob. 25QLPCh. 36 - Explain why GO and NOT GO gages (see Section...Ch. 36 - Prob. 27QLPCh. 36 - Prob. 28QLPCh. 36 - Prob. 29QLPCh. 36 - Prob. 31QLPCh. 36 - Beverage-can manufacturers try to achieve failure...Ch. 36 - Assume that in Example 36.3 the number of samples...Ch. 36 - Calculate the control limits for averages and...Ch. 36 - Calculate the control limits for (a) number of...Ch. 36 - In an inspection with a sample size of 12 and a...Ch. 36 - Prob. 37QTPCh. 36 - The average of averages of a number of samples of...Ch. 36 - Prob. 39QTPCh. 36 - Prob. 40QTPCh. 36 - Prob. 41SDPCh. 36 - Describe your thought on whether products should...Ch. 36 - Prob. 44SDPCh. 36 - Prob. 45SDPCh. 36 - Prob. 46SDPCh. 36 - Prob. 47SDPCh. 36 - Prob. 48SDPCh. 36 - Many components of products have a minimal effect...
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- Based on the following specification (Figure: 12), state whether the measured component would be accepted or rejected. Please give the reasons for your decision.arrow_forwardDescribe the non- destructive testing processes – dye penetrant, magnetic particle, ultrasonic and radiography – and include an example application for eacharrow_forwardGiven your understanding of what initiates and controls failure in materials, which of the following will increase the failure strength or lifetime of a test piece or component and why? a. Polishing to reduce surface defects b. Decreasing the temperature below the brittle-ductile transition temperature, to make it harder C. Increasing its volume, to give a larger cross sectional area d. Increasing the grain size so there are less grain boundaries to initiate failure e. Decreasing the difference between the maximum and minimum stress values, as this effects the stress concentration factorarrow_forward
- Explain at least three reasons why hardness testing is generally used for product quality control in industrial sites.arrow_forwardDescribe the relationship between force and surface area using specific quantitative examples. What type of measuring devices would be needed to provide the quantitiesarrow_forwardExplain the difference between qualative and quantative data in relation to materials testing.arrow_forward
- . What are the advantages and disadvantages of hot deformation as compared to cold deformationarrow_forwardExplain how stress concentration can be reduced when a notch is unavoidable in a mechanical component with neat sketches?arrow_forwardGiven your understanding of what initiates and controls failure in materials, which of the following will reduce the failure strength or lifetime of a test piece and why? a. (more than one answer is possible for this question. marks will only be awarded for the question if all the correct options are selected (i.e. 'all or nothing' marking scheme). b. LUS C. d. Increasing its volume, greater likelihood of critical defects Decreasing the loading frequency, the material will be at peak stress values for longer Decreasing the grain size, more grain boundaries to initiate failure Increasing the difference between the maximum and minimum stress values, as this affects the stress concentration factor Recent M Raising the temperature above the BDTT, more plastic deformation in the lattice will cause it to fail faster Garrow_forward
- Explain the types of faults and how the faults effecting the yield? Why accurate IC yield difficult to predict? Justify your answer with suitable reasons.arrow_forward2) What non-destructive testing methods use for metals with surface cracks (micro size)? Explain these methods.arrow_forwardWhat kind of defects or product characteristics can be detected by the Eddy-Current Testing?arrow_forward
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