Manufacturing Engineering & Technology
Manufacturing Engineering & Technology
7th Edition
ISBN: 9780133128741
Author: Serope Kalpakjian, Steven Schmid
Publisher: Prentice Hall
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Chapter 34, Problem 5RQ

Describe the principles of physical and chemical vapor deposition. What applications do these processes have?

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Compare the methods of vacuum thermal evaporation and vacuum sputtering in terms of technical realization (similarities, differences), advantages, and disadvantages.
Please explain and show examples of  chemical vapour deposition
(d) In one production line, there is ultrasonic machines (USM) and electro- discharge machines (EDM). You need to cut one material in form of thick plate. The material of the thick plate is aluminum. Choose the best machine that can be used to operate the plate. justify your answer by considering material removal rate, process duration, the material of the workpiece and the waste from the operation. (e) Discuss the major challenges in implementing computer integrated manufacturing (CIM) to the factory.

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