Degarmo's Materials And Processes In Manufacturing
13th Edition
ISBN: 9781119492825
Author: Black, J. Temple, Kohser, Ronald A., Author.
Publisher: Wiley,
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Chapter 29, Problem 54RQ
In metallization, what is the difference between a contact and a via?
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1 What is the difference between open-die and closed-die forging? Give an example of a metal product produced by each process.
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Chapter 29 Solutions
Degarmo's Materials And Processes In Manufacturing
Ch. 29 - Over the latter half of the 20th century, what...Ch. 29 - What was the major motivation for developing...Ch. 29 - Prob. 3RQCh. 29 - What is an example of a device feature that is...Ch. 29 - What type of manufacturing technology dominates...Ch. 29 - Name the four categories of miniature systems...Ch. 29 - Give two differences between lab-on-a-chip and...Ch. 29 - What is a scaling law?Ch. 29 - As the primary dimensions of an object decrease,...Ch. 29 - In the design of a water heater, the mean time...
Ch. 29 - Prob. 11RQCh. 29 - Name two conventional manufacturing processes that...Ch. 29 - Prob. 13RQCh. 29 - Why does breadth of scale of a product have an...Ch. 29 - What is the most complicated, expensive, and...Ch. 29 - Name three purposes that a resist mask can play.Ch. 29 - Name four key lithography methods.Ch. 29 - Name two through-mask lithography techniques.Ch. 29 - Name two direct-write lithography techniques.Ch. 29 - List the sequence of steps involved in...Ch. 29 - Of the two major classifications of photoresists,...Ch. 29 - List four requirements of a photoresist.Ch. 29 - What limits the resolution of a photoresist?Ch. 29 - What is meant by resist sensitivity?Ch. 29 - What is one requirement that contributes to the...Ch. 29 - List the three types of exposure methods used in...Ch. 29 - Why is projection printing equipment called a...Ch. 29 - What are typical materials etched during...Ch. 29 - What is etch bias?Ch. 29 - Prob. 30RQCh. 29 - What are some possible defects that can result...Ch. 29 - What are some possible defects that can result...Ch. 29 - List and describe two properties of etchants.Ch. 29 - What is etch anisotropy dependent upon?Ch. 29 - What is the difference between wet and dry?...Ch. 29 - What is dry etching?Ch. 29 - What are the three main categories of dry etching...Ch. 29 - What is the difference between plasma etching and...Ch. 29 - What is deep reactive ion etching?Ch. 29 - What is a benefit of using UV lasers to machine...Ch. 29 - Which type of non-lithographic micromachining...Ch. 29 - What are thin films?Ch. 29 - A) What is the difference between solution...Ch. 29 - What are the two broad categories of vapor...Ch. 29 - List two different types of physical vapor...Ch. 29 - List two advantages of sputtering over...Ch. 29 - What is meant by step coverage with regards to...Ch. 29 - Why is step coverage important?Ch. 29 - Prob. 49RQCh. 29 - What does gettering mean in relation to wafer...Ch. 29 - How are undesirable gas-phase reactions controlled...Ch. 29 - What is the key difference in the reactor designs...Ch. 29 - What are the two types of LPCVD reactor designs?...Ch. 29 - In metallization, what is the difference between a...Ch. 29 - What is the advantage of using plasma-enhanced on...Ch. 29 - A) What is epitaxy? B) is it important for...Ch. 29 - Name four techniques for solution deposition onto...Ch. 29 - Name four roll-to-roll processing techniques for...Ch. 29 - What is a semiconductor?Ch. 29 - Name three common semiconductor materials.Ch. 29 - Give three reasons why silicon is the most popular...Ch. 29 - Prob. 62RQCh. 29 - What is a silicon boule?Ch. 29 - Prob. 64RQCh. 29 - What are some geometric concerns involved with...Ch. 29 - What is meant by the term doping?Ch. 29 - What is the difference between n�type and...Ch. 29 - Name three methods for doping a silicon wafer.Ch. 29 - Prob. 69RQCh. 29 - Prob. 70RQCh. 29 - Prob. 71RQCh. 29 - Why are rapid thermal processing technologies...Ch. 29 - What are two ways in which silicon dioxide is...Ch. 29 - Give two reasons why wet oxidation is better...Ch. 29 - What is a p�n junction? \What can it be used...Ch. 29 - Prob. 76RQCh. 29 - Assuming an n�doped substrate is clean, list the...Ch. 29 - What is planarization and why is it needed?Ch. 29 - What is meant by the term ULSI?Ch. 29 - In general, what technological breakthroughs were...Ch. 29 - What drives the increase in component density and...Ch. 29 - Why are clean rooms so important to...Ch. 29 - What is the advantage of electron microscopy over...Ch. 29 - What is the collective advantage of...Ch. 29 - Why do samples analyzed in an electron microscopes...Ch. 29 - What are two differences between a scanning...Ch. 29 - What is important about a dual�beam focused ion...Ch. 29 - Why is white light normally preferred for...Ch. 29 - What is one advantage of an atomic force...Ch. 29 - What is the breadth of scale of an automotive...Ch. 29 - What is the breadth of scale of a computer...Ch. 29 - Which has a larger breadth of scale, the...Ch. 29 - Prob. 4PCh. 29 - A piece of silicon has an integrated resistor...Ch. 29 - Based on what you learned in problem #5, which...
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- Why do the supports that resist a force, such as a pin, restrict displacement?arrow_forwardBriefly cite the differences between the recovery and recrystallization processes.arrow_forwardThere are three temperature ranges in metal forming, cold working, warm working andhot working. Distinguish cold working from warm working including their advantages anddisadvantagesarrow_forward
- Question 3. 120 mm diameter and 600 mm long copper material will be produced by direct extrusion process as follows. Strength coefficient for copper is 300 MPa and plyumization base The pattern angle constants are 0.5. Accordingly, it is not the case. a) The rate of extrusion, b) The shape factor, c) While the remaining material in the cylinder is 500 mm, the force required to ensure the forward movement of the ram during extrusion, d) At the end of the process, if the volume of the last part of the cylinder is 0.4 dm3 find the length of the extruded part. 2,7 mm 55 mmarrow_forwardWhat is the concept of Strain?arrow_forwardDistinguish between the upper yield point and the lower yield point?arrow_forward
- A figure shown below is to be blanking through a blanking die The material is 4mm thick stainless steel (half hard) with Ac =0.075. Determine the dimensions of the blanking punch and the die openingarrow_forwardQ What is the difference between the Glass, Ceramic and Metal in terms of Plasticity?arrow_forward1) The stresses and strains in metal forming are of which type? Elastic_plastic_ultimatefracture_none of these 2) The applied stresses in most bulk deformation processes are- Shear_tensile_compressive_bending_none of these 3) What is the difference between the physical shape of bulk deformation and sheet metalworking manufacturing processes?. In bulk deformation, the work parts have a. area-to-volume ratio, whereas in sheet metalworking, the area-to-volume ratio is Low, high_high,low_high,high,low,low 4) is a bulk deformation process in which a workpiece is compressed between two opposing dies, so that the die shapes are imparted to the work. Rolling_forging_drawing_extrusions_none of these 5) is a compression bulk deformation process in which the work material is forced to flow through a die orifice, thereby forcing its cross section to assume the profile of the orifice Forging.extrusion_drawing.extendingrollingnone of these 6) is a bulk deformation process in which the diameter of a…arrow_forward
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