Manufacturing Engineering & Technology
7th Edition
ISBN: 9780133128741
Author: Serope Kalpakjian, Steven Schmid
Publisher: Prentice Hall
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Textbook Question
Chapter 29, Problem 3RQ
Why is silicon often used with MEMS devices?
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Discuss the importance of microchip manufacturing processes such as photolithography and etching in producing advanced microchips.
Write in detail following terminologies according to wafer fabrication processes:
a. Diffusion and Ion Implantation
b. Metallization
c. Etching
(b)
Figure 10 shows the holes dimensional accuracy of ECM, EDM, and EEDM
process.
Compare the accuracy of all processes as illustrated in Figure 10.
Electrolyte
Dielectric
Electrolyte
ЕСМ
EDM
EEDM
Figure 10: Holes drilled by ECM, EDM and EEDM
Chapter 29 Solutions
Manufacturing Engineering & Technology
Ch. 29 - Define MEMS, SIMPLE, SCREAM, and HEXSIL.Ch. 29 - Give three examples of common...Ch. 29 - Why is silicon often used with MEMS devices?Ch. 29 - Describe bulk and surface micromachining.Ch. 29 - What is the purpose of a spacer layer in...Ch. 29 - What is the main limitation to successful...Ch. 29 - What are common applications for MEMS andMEMS...Ch. 29 - Prob. 8RQCh. 29 - Prob. 9RQCh. 29 - Explain the differences between stereolithography...
Ch. 29 - What is MolTun? What are its main advantages?Ch. 29 - What is HEXSIL?Ch. 29 - What do SIMPLE and SCREAM stand for?Ch. 29 - Describe the difference between isotropic etching...Ch. 29 - Lithography produces projected shapes, so true...Ch. 29 - Which process or processes in this chapter allow...Ch. 29 - What is the difference between chemically reactive...Ch. 29 - The MEMS devices discussed in this chapter are...Ch. 29 - Explain how you would produce a spur gear if...Ch. 29 - Prob. 20QLPCh. 29 - Prob. 21QLPCh. 29 - Prob. 22QLPCh. 29 - Is there an advantage to using the MolTun process...Ch. 29 - The atomic-force microscope probe shown inFig....Ch. 29 - Estimate the natural frequency of the cantilever...Ch. 29 - Using data from Chapter 28, derive the time needed...Ch. 29 - It is desired to produce a 500 m by 500...Ch. 29 - If the Reynolds number for water flow through a...Ch. 29 - Prob. 30SDPCh. 29 - Prob. 31SDPCh. 29 - Prob. 32SDPCh. 29 - Design a micromachine or device that allows the...Ch. 29 - Conduct a literature search and determine the...Ch. 29 - Perform a literature search and write a...
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- Assume that a silicon diode is being used as a temperature detector. If its temperature increases, will its voltage drop increase or decrease?arrow_forwardAnswer each of the following questions in one to three sentences. (a) What is lithography field? (b) What is misalignment in lithography? (e) What is selectivity in an etching process? (d) What is end-point detection in an etching process?arrow_forwardDescribe the process of microchip manufacturing, including the use of photolithography and semiconductor materials.arrow_forward
- Explain the concept of microchip fabrication technology nodes and their impact on chip performance and power efficiency.arrow_forwardHow does microchip design differ from microchip fabrication, and what tools and software are commonly used in microchip design?arrow_forwardCreate an open ended question about processing nanomaterials with answerarrow_forward
- ANSWER THE FOLLOWING : Name one factor PCB fabricators consider when etching a design. Explain thoroughly (include images if applicable)arrow_forwardFor a given 40 cm diameter wafer, and a die that is 1.5 cm x 2 cm, determine the cost of a die. Wafer cost is $5800, wafer yield is 100%, and defects per unit area is 0.09/sq. cm.arrow_forwardCan you detailed summarize the benefits and the best application of PCD Diamondarrow_forward
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