The Texas Instruments LM135 Temperature Sensor has a thermal coefficient of 10 mV/°C. You want to use the sensor in a digital data acquisition system to measure a temperature range of -20 °C to +120 °C and need to convert the analogue output to a digital signal. a) In order to achieve a resolution of 0.1 °C and assuming that the reference voltage is 0-10 V, how many bits must the ADC have? b) Using your answer to part (a), what will the actual resolution of the system be? c) A Sample-and-Hold device is required before a signal is passed into an ADC. Explain why a Sample-and- Hold is required and using Figure Q3, describe how it functions.

2. Suppose first that we want to measure the temperature of a room with the following components. Direct connection Vcc = 3.3 V LM35 ADC The sensor is the LM35 chip, which gives a voltage proportional to temperature in degrees of Celsius so that 0°C gives zero voltage. The scaling factor is 10 mV/°C, indicating that the LM35 gives 200mV at 20°C and so on. The sensor is a silicon IC, not a thermistor. Its output is a linear function of temperature, which is convenient, but the voltage is small. a) Suppose the ADC is a 10-bit SAR, common in small microcontrollers, which takes its reference from the supply at 3.3V. We wish to resolve changes of 0.1°C or better over a range of 5°C to 30°C. Suppose first that we connect the output of the LM35 directly to the input of the ADC. What voltages must we measure? Is it possible to meet this specification without further components? Why? b) If the specifications in a) cannot be met. You can use an external ADC with a better resolution. Assume that…

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b) Draw a fully labelled block diagram of a demodulator suitable for DSB-AM, DSB-SC, and SSB signals. Explain briefly it's operation, and why a simple diode detector would not have been suitable.

Discuss the importance of analog-to-digital converters (ADCs) in microcontroller applications. Provide examples of analog sensors commonly interfaced with microcontrollers.

Explain the workflow of computational modelling process in 3D printed electronics.