The rate at which energy must be dissipated away from single integrated circuits (computer chips) continues to increase as transitors continue to shrink in size and more and more computations are being completed in smaller and smaller volumes. The maximum chip temperature, however, has not changed much over time and remains around Tc = 75 °C. To increase the rate of dissipation of thermal energy away from a new chip, it is proposed to add a 5 x 5 array of copper pin fins to the chip. Each fin will be individually joined to the chip surface such that there is a minimal contact resistance between the fin and the chip. The diameter of the fins is df = 1 mm and the length is Lf = 15 mm. The chip is square, with a side length of W= 15 mm. It is so thin that it can be treated as having a single temperature. A dielectric liquid flows over the outer surface of the chip and around the fins, with a temperature of T»,f= 20 °C and a convection coefficient of hf = 1150 W/m²-K. The chip is joined to a circuit board via an epoxy, and there is a thermal contact resistance at the joint of R"t.c= 5×10-4 m2-K/w. The circuit board is made of a material with a thermal conductivity of kp = 5 W/m-K and is Lb = 7.5 mm thick. The bottom of the circuit board is exposed to a flow of air for which hb = 50 W/m2-K and Too,b = 20 °C. Тоp view Pin fins Side view -de Chip Board, k W -Contact resistance When the chip is at its maximum temperature of Tc = 75 °C, what is the rate at which thermal energy is being transferred away from the chip? Report your answer in the units of Watts.
The rate at which energy must be dissipated away from single integrated circuits (computer chips) continues to increase as transitors continue to shrink in size and more and more computations are being completed in smaller and smaller volumes. The maximum chip temperature, however, has not changed much over time and remains around Tc = 75 °C. To increase the rate of dissipation of thermal energy away from a new chip, it is proposed to add a 5 x 5 array of copper pin fins to the chip. Each fin will be individually joined to the chip surface such that there is a minimal contact resistance between the fin and the chip. The diameter of the fins is df = 1 mm and the length is Lf = 15 mm. The chip is square, with a side length of W= 15 mm. It is so thin that it can be treated as having a single temperature. A dielectric liquid flows over the outer surface of the chip and around the fins, with a temperature of T»,f= 20 °C and a convection coefficient of hf = 1150 W/m²-K. The chip is joined to a circuit board via an epoxy, and there is a thermal contact resistance at the joint of R"t.c= 5×10-4 m2-K/w. The circuit board is made of a material with a thermal conductivity of kp = 5 W/m-K and is Lb = 7.5 mm thick. The bottom of the circuit board is exposed to a flow of air for which hb = 50 W/m2-K and Too,b = 20 °C. Тоp view Pin fins Side view -de Chip Board, k W -Contact resistance When the chip is at its maximum temperature of Tc = 75 °C, what is the rate at which thermal energy is being transferred away from the chip? Report your answer in the units of Watts.
Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)
8th Edition
ISBN:9781305387102
Author:Kreith, Frank; Manglik, Raj M.
Publisher:Kreith, Frank; Manglik, Raj M.
Chapter8: Natural Convection
Section: Chapter Questions
Problem 8.36P
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Transcribed Image Text:The rate at which energy must be dissipated away from single integrated circuits (computer chips) continues to increase as transitors
continue to shrink in size and more and more computations are being completed in smaller and smaller volumes. The maximum chip
temperature, however, has not changed much over time and remains around Tc = 75 °C. To increase the rate of dissipation of thermal
energy away from a new chip, it is proposed to add a 5 x 5 array of copper pin fins to the chip. Each fin will be individually joined to the
chip surface such that there is a minimal contact resistance between the fin and the chip. The diameter of the fins is df = 1 mm and the
length is Lf = 15 mm. The chip is square, with a side length of W= 15 mm. It is so thin that it can be treated as having a single
temperature. A dielectric liquid flows over the outer surface of the chip and around the fins, with a temperature of T»,f= 20 °C and a
convection coefficient of hf = 1150 W/m²-K. The chip is joined to a circuit board via an epoxy, and there is a thermal contact resistance
at the joint of R"t.c= 5×10-4 m2-K/w. The circuit board is made of a material with a thermal conductivity of kp = 5 W/m-K and is Lb = 7.5
mm thick. The bottom of the circuit board is exposed to a flow of air for which hb = 50 W/m2-K and Too,b = 20 °C.
Тоp view
Pin fins
Side view
-de
Chip
Board, k
W
-Contact resistance
When the chip is at its maximum temperature of Tc = 75 °C, what is the rate at which thermal energy is being transferred away from the
chip? Report your answer in the units of Watts.
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