Elements Of Electromagnetics
Elements Of Electromagnetics
7th Edition
ISBN: 9780190698614
Author: Sadiku, Matthew N. O.
Publisher: Oxford University Press
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An isothermal silicon chip of width W= 20 mm on a side is soldered to an aluminum heat sink (k = 180
W/m-K) of equivalent width. The heat sink has a base thickness of Lb = 3 mm and an array of N = 11
rectangular fins, each of length Lf =15 mm and thickness t = 0.182 mm. The fin pitch is S = 1.982 mm.
Airflow at To = 20°C is maintained through channels formed by the fins and a cover plate, and the flow
is such that a convection coefficient of h = 100 W/m2-K is maintained on all surfaces of the fins. The
solder joint has a thermal resistance of R.= 2x10-6 m2-Kw. How much thermal energy is dissipated
't,c
away from the chip when the chip is at its maximum allowable temperature of Tc = 85°C? An adiabatic
fin tip condition may be assumed, and airflow along the outer surfaces of the heat sink may be
assumed to provide a convection coefficient equivalent to that associated with airflow through the
channels.
Chip, T. Ic
Solder, R.
W
Heat sink, k
Cover plate
Air
T, h
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Transcribed Image Text:An isothermal silicon chip of width W= 20 mm on a side is soldered to an aluminum heat sink (k = 180 W/m-K) of equivalent width. The heat sink has a base thickness of Lb = 3 mm and an array of N = 11 rectangular fins, each of length Lf =15 mm and thickness t = 0.182 mm. The fin pitch is S = 1.982 mm. Airflow at To = 20°C is maintained through channels formed by the fins and a cover plate, and the flow is such that a convection coefficient of h = 100 W/m2-K is maintained on all surfaces of the fins. The solder joint has a thermal resistance of R.= 2x10-6 m2-Kw. How much thermal energy is dissipated 't,c away from the chip when the chip is at its maximum allowable temperature of Tc = 85°C? An adiabatic fin tip condition may be assumed, and airflow along the outer surfaces of the heat sink may be assumed to provide a convection coefficient equivalent to that associated with airflow through the channels. Chip, T. Ic Solder, R. W Heat sink, k Cover plate Air T, h
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