An isothermal silicon chip of width W = 20 mm on a side is soldered to an aluminum heat sink (k = 180 W/m-K) of equivalent width. The heat sink has a base thickness of Lb = 3 mm and an array of N = 11 rectangular fins, each of length Lf =15 mm and thickness t = 0.182 mm. The fin pitch is S= 1.982 mm. Airflow at To = 20°C is maintained through channels formed by the fins and a cover plate, and the flow is such that a convection coefficient of h = 100 W/m2-K is maintained on all surfaces of the fins. The solder joint has a thermal resistance of R" = 2x10-6 m2-K/W. How much thermal energy is dissipated 't,c away from the chip when the chip is at its maximum allowable temperature of Tc = 85°C? An adiabatic fin tip condition may be assumed, and airflow along the outer surfaces of the heat sink may be assumed to provide a convection coefficient equivalent to that associated with airflow through the channels. Chip, T. Ic Solder. R"

An isothermal silicon chip of width W = 20 mm on a side is soldered to an aluminum heat sink (k = 180 W/m-K) of equivalent width. The heat sink has a base thickness of Lb = 3 mm and an array of N = 11 rectangular fins, each of length Lf =15 mm and thickness t = 0.182 mm. The fin pitch is S= 1.982 mm. Airflow at To = 20°C is maintained through channels formed by the fins and a cover plate, and the flow is such that a convection coefficient of h = 100 W/m2-K is maintained on all surfaces of the fins. The solder joint has a thermal resistance of R" = 2x10-6 m2-K/W. How much thermal energy is dissipated 't,c away from the chip when the chip is at its maximum allowable temperature of Tc = 85°C? An adiabatic fin tip condition may be assumed, and airflow along the outer surfaces of the heat sink may be assumed to provide a convection coefficient equivalent to that associated with airflow through the channels. Chip, T. Ic Solder. R"

Elements Of Electromagnetics

7th Edition

ISBN:9780190698614

Author:Sadiku, Matthew N. O.

Publisher:Sadiku, Matthew N. O.

ChapterMA: Math Assessment

Section: Chapter Questions

Problem 1.1MA

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