An isothermal silicon chip of width W = 20 mm on a side is soldered to an aluminum heat sink (k = 180 W/m-K) of equivalent width. The heat sink has a base thickness of Lb = 3 mm and an array of N = 11 rectangular fins, each of length Lf =15 mm and thickness t = 0.182 mm. The fin pitch is S= 1.982 mm. Airflow at To = 20°C is maintained through channels formed by the fins and a cover plate, and the flow is such that a convection coefficient of h = 100 W/m2-K is maintained on all surfaces of the fins. The solder joint has a thermal resistance of R" = 2x10-6 m2-K/W. How much thermal energy is dissipated 't,c away from the chip when the chip is at its maximum allowable temperature of Tc = 85°C? An adiabatic fin tip condition may be assumed, and airflow along the outer surfaces of the heat sink may be assumed to provide a convection coefficient equivalent to that associated with airflow through the channels. Chip, T. Ic Solder. R"

Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
Problem 1.1MA
icon
Related questions
Question
An isothermal silicon chip of width W= 20 mm on a side is soldered to an aluminum heat sink (k = 180
W/m-K) of equivalent width. The heat sink has a base thickness of Lb = 3 mm and an array of N = 11
rectangular fins, each of length Lf =15 mm and thickness t = 0.182 mm. The fin pitch is S = 1.982 mm.
Airflow at To = 20°C is maintained through channels formed by the fins and a cover plate, and the flow
is such that a convection coefficient of h = 100 W/m2-K is maintained on all surfaces of the fins. The
solder joint has a thermal resistance of R.= 2x10-6 m2-Kw. How much thermal energy is dissipated
't,c
away from the chip when the chip is at its maximum allowable temperature of Tc = 85°C? An adiabatic
fin tip condition may be assumed, and airflow along the outer surfaces of the heat sink may be
assumed to provide a convection coefficient equivalent to that associated with airflow through the
channels.
Chip, T. Ic
Solder, R.
W
Heat sink, k
Cover plate
Air
T, h
Transcribed Image Text:An isothermal silicon chip of width W= 20 mm on a side is soldered to an aluminum heat sink (k = 180 W/m-K) of equivalent width. The heat sink has a base thickness of Lb = 3 mm and an array of N = 11 rectangular fins, each of length Lf =15 mm and thickness t = 0.182 mm. The fin pitch is S = 1.982 mm. Airflow at To = 20°C is maintained through channels formed by the fins and a cover plate, and the flow is such that a convection coefficient of h = 100 W/m2-K is maintained on all surfaces of the fins. The solder joint has a thermal resistance of R.= 2x10-6 m2-Kw. How much thermal energy is dissipated 't,c away from the chip when the chip is at its maximum allowable temperature of Tc = 85°C? An adiabatic fin tip condition may be assumed, and airflow along the outer surfaces of the heat sink may be assumed to provide a convection coefficient equivalent to that associated with airflow through the channels. Chip, T. Ic Solder, R. W Heat sink, k Cover plate Air T, h
Expert Solution
trending now

Trending now

This is a popular solution!

steps

Step by step

Solved in 3 steps with 2 images

Blurred answer
Knowledge Booster
Convection
Learn more about
Need a deep-dive on the concept behind this application? Look no further. Learn more about this topic, mechanical-engineering and related others by exploring similar questions and additional content below.
Similar questions
  • SEE MORE QUESTIONS
Recommended textbooks for you
Elements Of Electromagnetics
Elements Of Electromagnetics
Mechanical Engineering
ISBN:
9780190698614
Author:
Sadiku, Matthew N. O.
Publisher:
Oxford University Press
Mechanics of Materials (10th Edition)
Mechanics of Materials (10th Edition)
Mechanical Engineering
ISBN:
9780134319650
Author:
Russell C. Hibbeler
Publisher:
PEARSON
Thermodynamics: An Engineering Approach
Thermodynamics: An Engineering Approach
Mechanical Engineering
ISBN:
9781259822674
Author:
Yunus A. Cengel Dr., Michael A. Boles
Publisher:
McGraw-Hill Education
Control Systems Engineering
Control Systems Engineering
Mechanical Engineering
ISBN:
9781118170519
Author:
Norman S. Nise
Publisher:
WILEY
Mechanics of Materials (MindTap Course List)
Mechanics of Materials (MindTap Course List)
Mechanical Engineering
ISBN:
9781337093347
Author:
Barry J. Goodno, James M. Gere
Publisher:
Cengage Learning
Engineering Mechanics: Statics
Engineering Mechanics: Statics
Mechanical Engineering
ISBN:
9781118807330
Author:
James L. Meriam, L. G. Kraige, J. N. Bolton
Publisher:
WILEY