A square silicon chip 7 mm x 7 mm in size and 0.5-mm thick is mounted on a plastic substrate as shown in the sketch below. The top surface of the chip is cooled by a synthetic liquid flowing over it. Electronic circuits on the bottom of the chip generate heat at a rate of 5 W that must be transferred through the chip. Estimate the steady-state between the front and back surfaces of the temperature difference chip. The thermal conductivity of silicon is W 150 mK Silicon chip Synthetic liquid Substrate

I have a problem similar to this in my case the problem is from the outside in. the heat is entering the interior and I don't know what temperature it will have inside since part of the heat will be lost in the thickness of the cylinder, I want to know how to fix the formula so that I can obtain the temperature inside the cylinder.

Consider the square channel shown in the sketch operating under steady state condition. The inner surface of the channel is at a uniform temperature of 600 K and the outer surface is at a uniform temperature of 300 K. From a symmetrical elemental of the channel, a two-dimensional grid has been constructed as in the right figure below. The points are spaced by equal distance. Tout = 300 K k = 1 W/m-K T = 600 K (a) The heat transfer from inside to outside is only by conduction across the channel wall. Beginning with properly defined control volumes, derive the finite difference equations for locations 123. You can also use (n, m) to represent row and column. For example, location Dis (3, 3), location is (3,1), and location 3 is (3,5). (hint: I have already put a control volume around this locations with dashed boarder.) (b) Please use excel to construct the tables of temperatures and finite difference. Solve for the temperatures of each locations. Print out the tables in the spread…

any help would be much appreciated thanks