Elements Of Electromagnetics
7th Edition
ISBN: 9780190698614
Author: Sadiku, Matthew N. O.
Publisher: Oxford University Press
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- 2. Electrical components often failure due to thermal overload. It follows that thermal analysis of electrical components is critical to their longevity. Consider a silicon chip which is sitting atop a ceramic substrate with 35 mm2 of exposed surface area. Operating at steady state, the chip can pull up to 120 mW of power. The chip surface is cooled by convection from flowing air at 20°C. The heat transfer from the chip to the air is given by Q = hA(T, – T) where h is the thermal convection coefficient, A is the exposed surface area, and Tb and Tr are absolute temperatures of the body and coolant fluid, respectively. h of the flowing air is found to be 250 W/(m2-K). Assuming heat transfer to the substrate is negligible compared to convection, determine: the heat transfer occurring at steady state (W) the temperature at the outer surface of the chip ("C) a. b.arrow_forwardThis question requires the use of the extracts from the tables of thermodynamic properties supplied. Ammonia, NH3, was once a commonly used refrigerant. In a particular (very old) refrigeration plant, ammonia has a pressure of 2.9 bar and a temperature of 40 °C. What would be the specific enthalpy of the ammonia under these conditions. 1433 kJ/kg a. b. 1552 kJ/kg 135 kJ/kg O d. 1622 kJ/kg O e. 1665 kJ/kgarrow_forwardFor a closed system undergoing a thermodynamic cycle, what statement from the list below is correct when comparing the system's initial and final states? Temperature may change. O Pressure may change Volume may change Mass may change Internal energy may change Potential energy may change No system property may changearrow_forward
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