which of the following will reduce the failure strength or lifetime of a test piece and why?  Decreasing the grain size, more grain boundaries to initiate failure Raising the temperature above the BDTT, more plastic deformation in the lattice will cause it to fail faster   Increasing its volume, greater likelihood of critical defects Decreasing the loading frequency, the material will be at peak stress values for longer  Increasing the di

Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
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(one or more option can be true please select from below)

which of the following will reduce the failure strength or lifetime of a test piece and why? 

Decreasing the grain size, more grain boundaries to initiate failure

Raising the temperature above the BDTT, more plastic deformation in the lattice will cause it to fail faster

  Increasing its volume, greater likelihood of critical defects

Decreasing the loading frequency, the material will be at peak stress values for longer

 Increasing the difference between the maximum and minimum stress values, as this affects the stress concentration factor

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