9.5 The following thermal bimorph is made of Silicon with a thermal conductivityk = 130 W/(m°C), Young's modulus E = 200 GPa, Poisson's ratio v = 0.27, and ther-mal expansion coefficient a = 2.6 × 10-6/°C. It is 1 mm thick with fixed tempera-tures of 60°C and 10°C, respectively, at the leftmost ends of its hot arm and coldarm, as shown below. Suppose the bimorph has a uniform internal heat genera-tion at 100 W/m³, and ignore the effects of convective heat transfer. (1) Determinethe steady-state temperature distribution in the thermal bimorph. (2) Determinethe thermally induced deformation and stresses in the bimorph if the two armsare fixed on their left ends.Hot armThot = 60°CCold armTcold = 10°CAll dimensions are in millimeters.6.000-3.0002.0002.00020012.0005.0003.000

Given:- k=130W/m E=200GPa T hot =60degree C T cool=10 Degree C To find:- a)steady state temperature…

spansion coefficient a = 2.6 × 10-6/°C. It is 1 mm thick with fixec of 60°C and 10°C, respectively, at the leftmost ends of its hot arn s shown below. Suppose the bimorph has a uniform internal he 100 W/m³, and ignore the effects of convective heat transfer. (1) eady-state temperature distribution in the thermal bimorph. (2) ermally induced deformation and stresses in the bimorph if the ed on their left ends.

spansion coefficient a = 2.6 × 10-6/°C. It is 1 mm thick with fixec of 60°C and 10°C, respectively, at the leftmost ends of its hot arn s shown below. Suppose the bimorph has a uniform internal he 100 W/m³, and ignore the effects of convective heat transfer. (1) eady-state temperature distribution in the thermal bimorph. (2) ermally induced deformation and stresses in the bimorph if the ed on their left ends.

Materials Science And Engineering Properties

1st Edition

ISBN:9781111988609

Author:Charles Gilmore

Publisher:Charles Gilmore

Chapter6: Introduction To Mechanical Properties

Section: Chapter Questions

Problem 6.8P

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