Answered: Diamond blade- 0.75 mm thickness Si…

Chemistry for Engineering Students

4th Edition

ISBN:9781337398909

Author:Lawrence S. Brown, Tom Holme

Publisher:Lawrence S. Brown, Tom Holme

Chapter1: Introduction To Chemistry

Section: Chapter Questions

Problem 1.75PAE: 1.75 What does it mean that ITO films are made by deposition? In what phase do materials begin, and...

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Question

Silicon for computer chips is grown in large cylinders called
“boules” that are 300 mm in diameter and 2 m in length, as
shown. The density of silicon is 2.33 g/cm³. Silicon wafers
for making integrated circuits are sliced from a 2.0-m boule
and are typically 0.75 mm thick and 300 mm in diameter.
(a) How many wafers can be cut from a single boule?
(b) What is the mass of a silicon wafer? (The volume of a cylinder
is given by πr²h, where r is the radius and h is its height.)

Diamond blade-
0.75 mm
thickness
Si boule
- 300 mm
diameter
Cut wafers
2 m

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