Air cools the top and bottom of an electronic chip that uniformly generates heat. At steady-state, which plot represents the temperature profile within the chip? a. D. T d. none of the above

A process stream is cooled from 80C to 40C in a shell-and-tube heat exchanger using cooling water in the tube side that enters the cooler at 30C and leaves at 38C under nominal condition. It has been determined that the process side resistance to heat transfer is dominant. It is desired that the process fluid flowrate through the cooler be decreased to 60% of its nominal value. For this condition, answer the following: a) By how much the cooling water flowrate be changed to maintain the process side exit temperature at 40C?    (b)   What is the exit temperature of the cooling water in this case?

Heat Transfer to an Apple. It is desired to predict the heat-transfer coefficient for air being blown by an apple lying on a screen with large openings. The air velocity is 0.61 m/s at 101.32 kPa pressure and 316.5 K. The surface of the apple is at 277.6 K and its average diameter is 114 mm. Assume that it is a sphere.

Transport Phenomena Question