(a)  Does the C2F6 flow rate affect the wafer-to-wafer variability in etch uniformity?  Use = 0.05. (b) Draw box plots to assist in the interpretation of the data from this experiment

Given the following size frequency for a dust: Size Interval (um) 7-17.5 17.5-21 21-25 25-28 28-30 30-33 33-36 36-41 41-49 49-70 % by Number 10 10 10 10 10 10 10 10 10 10 a. Plot the cumulative frequency distributions (in %) of the number, surface area, and mass on linear graph paper assuming all particles are spheres with Pp 1.6 g cm ³. = b. Is this a log-normally distributed dust?

An article in Solid State Technology, "Orthogonal Design of Process Optimization and Its Application to Plasma Etching" by G.Z. Yin and D.W. Jillie (May, 1987) describes an experiment to determine the effect of C2F6 flow rate on the uniformity of the etch on a silicon wafer used in integrated circuit manufacturing.  Data for two flow rates are as follows: C2F6 Uniformity Observation (SCCM) 1 2 3 4 5 6 125 2.7 4.6 2.6 3.0 3.2 3.8 200 4.6 3.4 2.9 3.5 4.1 5.1 C2F6 Uniformity Observation (SCCM) 1 2 3 4 5 6 125 2.7 4.6 2.6 3.0 3.2 3.8 200 4.6 3.4 2.9 3.5 4.1 5.1 (a)  Does the C2F6 flow rate affect average etch uniformity?  Use = 0.05. (b)  What is the P-value for the test in part (a)?

Calculate the modulus of elasticity of a metal-matrix composite under isostrain conditions. Assume an aluminum matrix is reinforced by 80 vol % SiC fibers. Express your answer to three significant digits. The modulus of elasticity is Submit Request Answer | ΑΣΦ | | vec ? MPa.