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A computer consists of an array of five printed circuit boards (PCBs), each dissipating P, = 20 W of power. Cooling of the electronic components on a board is pro- vided by the forced flow of air, equally distributed in passages formed by adjoining boards, and the convec- tion coefficient associated with heat transfer from the components to the air is approximately h= 200 W/m².K. Air enters the computer console at a temperature of T= 20°C, and flow is driven by a fan whose power consumption is P₁ = 25 W. Outlet air, T PCB, P 1000 040040 090040 CUJU ttt Inlet air , Ti Fan, Pf (a) If the temperature rise of the airflow, (T. -T), is not to exceed 15°C, what is the minimum allowable volu- metric flow rate of the air? The density and specific heat of the air may be approximated as p = 1.161 kg/m³ and c, = 1007 J/kg. K, respectively. (b) The component that is most susceptible to thermal failure dissipates 1 W/cm² of surface area. To mini- mize the potential for thermal failure, where should the component be installed on a PCB? What is its surface temperature at this location?

A computer consists of an array of five printed circuit boards (PCBs), each dissipating P, = 20 W of power. Cooling of the electronic components on a board is pro- vided by the forced flow of air, equally distributed in passages formed by adjoining boards, and the convec- tion coefficient associated with heat transfer from the components to the air is approximately h= 200 W/m².K. Air enters the computer console at a temperature of T= 20°C, and flow is driven by a fan whose power consumption is P₁ = 25 W. Outlet air, T PCB, P 1000 040040 090040 CUJU ttt Inlet air , Ti Fan, Pf (a) If the temperature rise of the airflow, (T. -T), is not to exceed 15°C, what is the minimum allowable volu- metric flow rate of the air? The density and specific heat of the air may be approximated as p = 1.161 kg/m³ and c, = 1007 J/kg. K, respectively. (b) The component that is most susceptible to thermal failure dissipates 1 W/cm² of surface area. To mini- mize the potential for thermal failure, where should the component be installed on a PCB? What is its surface temperature at this location?

Introduction to Chemical Engineering Thermodynamics
Introduction to Chemical Engineering Thermodynamics
8th Edition
ISBN:9781259696527
Author:J.M. Smith Termodinamica en ingenieria quimica, Hendrick C Van Ness, Michael Abbott, Mark Swihart
Publisher:J.M. Smith Termodinamica en ingenieria quimica, Hendrick C Van Ness, Michael Abbott, Mark Swihart
Chapter1: Introduction
Section: Chapter Questions
Problem 1.1P
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A computer consists of an array of five printed circuit boards (PCBs), each dissipating P, = 20 W of power. Cooling of the electronic components on a board is pro- vided by the forced flow of air, equally distributed in passages formed by adjoining boards, and the convec- tion coefficient associated with heat transfer from the components to the air is approximately h = 200 W/m².K. Air enters the computer console at a temperature of T₁= 20°C, and flow is driven by a fan whose power consumption is P = 25 W. PCB, Pb salool Outlet air, T J-00-1 090040 UJ JJ ttt Inlet air, Ti Fan, Pf (a) If the temperature rise of the airflow, (T — Tì), is not to exceed 15°C, what is the minimum allowable volu- metric flow rate of the air? The density and specific heat of the air may be approximated as p = 1.161 kg/m³ and c = 1007 J/kg • K, respectively. (b) The component that is most susceptible to thermal failure dissipates 1 W/cm² of surface area. To mini- mize the potential for thermal failure, where should the component be installed on a PCB? What is its surface temperature at this location?
Transcribed Image Text:A computer consists of an array of five printed circuit boards (PCBs), each dissipating P, = 20 W of power. Cooling of the electronic components on a board is pro- vided by the forced flow of air, equally distributed in passages formed by adjoining boards, and the convec- tion coefficient associated with heat transfer from the components to the air is approximately h = 200 W/m².K. Air enters the computer console at a temperature of T₁= 20°C, and flow is driven by a fan whose power consumption is P = 25 W. PCB, Pb salool Outlet air, T J-00-1 090040 UJ JJ ttt Inlet air, Ti Fan, Pf (a) If the temperature rise of the airflow, (T — Tì), is not to exceed 15°C, what is the minimum allowable volu- metric flow rate of the air? The density and specific heat of the air may be approximated as p = 1.161 kg/m³ and c = 1007 J/kg • K, respectively. (b) The component that is most susceptible to thermal failure dissipates 1 W/cm² of surface area. To mini- mize the potential for thermal failure, where should the component be installed on a PCB? What is its surface temperature at this location?
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