3) A p-type <111> oriented silicon wafer (10¹5 cm ³) is placed in a wet oxidation system to grow a field oxide of 600 Å at 1000 °C. i) Determine the time required to grow the field oxide. ii) After this first oxidation, the oxide over region A is removed. Then a diffusion step is carried out in which phosphorus is diffused into the wafer and the surface concentration of phosphorus is 3x1020 cm³. Next, a dry oxidation step is performed at 900 °C for 60 minutes. Find the thickness of the oxide over region A and the new thickness of the oxide over the other area (B in the figure below). Ignore any chemical or structural differences in the field oxide and gate oxide in terms of the oxidation kinetics. Explain why wet oxidation is used for the field oxide and dry oxidation is urad for the gate oxida
3) A p-type <111> oriented silicon wafer (10¹5 cm ³) is placed in a wet oxidation system to grow a field oxide of 600 Å at 1000 °C. i) Determine the time required to grow the field oxide. ii) After this first oxidation, the oxide over region A is removed. Then a diffusion step is carried out in which phosphorus is diffused into the wafer and the surface concentration of phosphorus is 3x1020 cm³. Next, a dry oxidation step is performed at 900 °C for 60 minutes. Find the thickness of the oxide over region A and the new thickness of the oxide over the other area (B in the figure below). Ignore any chemical or structural differences in the field oxide and gate oxide in terms of the oxidation kinetics. Explain why wet oxidation is used for the field oxide and dry oxidation is urad for the gate oxida
Chemistry
10th Edition
ISBN:9781305957404
Author:Steven S. Zumdahl, Susan A. Zumdahl, Donald J. DeCoste
Publisher:Steven S. Zumdahl, Susan A. Zumdahl, Donald J. DeCoste
Chapter1: Chemical Foundations
Section: Chapter Questions
Problem 1RQ: Define and explain the differences between the following terms. a. law and theory b. theory and...
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