2. Describe the correct resist and mask polarities to make holes and islands in wafer surface layers.

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2. Describe the correct resist and mask polarities to
make holes and islands in wafer surface layers.
3. Explain the purpose and methods of hard bake.
4. Why would you select one alignment method over
another?
5. What defects occur in photoresist?
6. Why would you use the puddle procedure?
Transcribed Image Text:2. Describe the correct resist and mask polarities to make holes and islands in wafer surface layers. 3. Explain the purpose and methods of hard bake. 4. Why would you select one alignment method over another? 5. What defects occur in photoresist? 6. Why would you use the puddle procedure?
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