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1. An array of electronic chips is mounted within a sealed rectangular enclosure, and cooling is implemented by attaching an aluminum heat sink (k-180) The base of the heat sink has dimensions of w₁₂-100mm, while the 6 fins are of thickness t-10mm and pitch S - 18mm The fin length is L.; = 50mm, and the base of the heat sink has a thickness of L - 10mm 41 S чии Water T -T -Chips Electronic- package, P It cooling is implemented by water flow through the heat sink, with 3 and T- 17C, what is the base temperature 7 of the heat sink when power dissipation by the chips is Pader-1800W? The average convection coefficient for surfaces of the fins and the exposed base may be estimated by assuming parallel flow over a flat plate Properties of the water may be approxomated as &-0.62-p-995-4178 -7.73 x 10² and Pr-5.2 Answer 46.2 C

1. An array of electronic chips is mounted within a sealed rectangular enclosure, and cooling is implemented by attaching an aluminum heat sink (k-180) The base of the heat sink has dimensions of w₁₂-100mm, while the 6 fins are of thickness t-10mm and pitch S - 18mm The fin length is L.; = 50mm, and the base of the heat sink has a thickness of L - 10mm 41 S чии Water T -T -Chips Electronic- package, P It cooling is implemented by water flow through the heat sink, with 3 and T- 17C, what is the base temperature 7 of the heat sink when power dissipation by the chips is Pader-1800W? The average convection coefficient for surfaces of the fins and the exposed base may be estimated by assuming parallel flow over a flat plate Properties of the water may be approxomated as &-0.62-p-995-4178 -7.73 x 10² and Pr-5.2 Answer 46.2 C

Applications and Investigations in Earth Science (9th Edition)
Applications and Investigations in Earth Science (9th Edition)
9th Edition
ISBN:9780134746241
Author:Edward J. Tarbuck, Frederick K. Lutgens, Dennis G. Tasa
Publisher:Edward J. Tarbuck, Frederick K. Lutgens, Dennis G. Tasa
Chapter1: The Study Of Minerals
Section: Chapter Questions
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1. An array of electronic chips is mounted within a sealed rectangular enclosure, and cooling is implemented by attaching an aluminum heat sink (k-180) The base of the heat sink has dimensions of w₁₂-100mm, while the 6 fins are of thickness t- 10mm and pitch S - 18mm The fin length is L; = 50mm, and the base of the heat sink has a thickness of L - 10mm → S CHA Water T -7.73 x 10-1² and Pr-5.2 Answer 46.2 C -T -Chips Electronic package, P If cooling is implemented by water flow through the heat sink, with 3 and T 17C, what is the base temperature 7 of the heat sink when power dissipation by the chips is Pader-1800W? The average convection coefficient for surfaces of the fins and the exposed base may be estimated by assuming parallel flow over a flat plate Properties of the water may be approximated as k 0.62 p-995-4178
Transcribed Image Text:1. An array of electronic chips is mounted within a sealed rectangular enclosure, and cooling is implemented by attaching an aluminum heat sink (k-180) The base of the heat sink has dimensions of w₁₂-100mm, while the 6 fins are of thickness t- 10mm and pitch S - 18mm The fin length is L; = 50mm, and the base of the heat sink has a thickness of L - 10mm → S CHA Water T -7.73 x 10-1² and Pr-5.2 Answer 46.2 C -T -Chips Electronic package, P If cooling is implemented by water flow through the heat sink, with 3 and T 17C, what is the base temperature 7 of the heat sink when power dissipation by the chips is Pader-1800W? The average convection coefficient for surfaces of the fins and the exposed base may be estimated by assuming parallel flow over a flat plate Properties of the water may be approximated as k 0.62 p-995-4178
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