The figure 1 gives a brief description of the 3-D FinFET structures which have been simulated. According to the International Technology Roadmap for Semiconductors (ITRS), The gate length (Lgate) is 15 nm, which corresponds to the 7/8-nm technology having 0.64 nm as gate- oxide thickness. The height (HSi) and width of fin (WSi) are 40nm and 8nm respectively whereas the the fin pitch is 30 nm and the fin aspect ratio is 5 which are taken from the characteristics of Intel 22-nm [1] and 14-nm FinFET technology [7]. The gate work function has been assumed to be tunably achieve an OFF-state leakage current (IOFF) of up to 30 pA/μm which has been consistent with TSMC’s 16-nm FinFET technology [8] which primarily was used for low-power …show more content…
The fin sidewall surfaces along which the transistor current flows were assumed to be {110} crystallographic planes, with transistor current flow in a ⟨110⟩ direction. To boost transistor ON-state current, 2-GPa (tensile) uniaxial stress has been introduced in the fin channel region for nFETs, whereas −2-GPa (compressive) uniaxial stress was introduced in the fin channel region for pFETs.
The effective channel length (Leff) and the peak location of the PTS doping profile (Xdepth) for the SSR FinFETs have been optimized individually such that to ensure the ON-state drive current Id, sat is maximized, whereas maintaining the OFF-state current specification at (IOFF = 30 pA/μm).
The Table II provides an overview of the important performance parameters for the given FinFET devices which have been optimized. Using the constant current criterion of 100 nA×(Weff/Lgate), the threshold voltage, Vt, has been used. For operating voltage VDD = 0.80 V (consistent with ITRS 2013 specifications for the 7/8-nm low-power technology node [6]), SSR FinFET provides for 3.6% and 3.8% improvement in Id,sat for nFETs and pFETs, respectively. The benefit of higher carrier mobility is greater for operation in the linear regime (Vgs = 0.8 V and Vds = 50 mV): SSR FinFET provides for 6.7% and 6% improvement
was derived and a relationship between Vinv and Vc was obtained (see Fig. 2). Applying voltage balance
15. Load transient response is simulated under load variations from 0mA to 50mA that step load current has 100ns rise/fall times. The maximum overshoot and undershoot is 45.2mV and 30mV, respectively. It is evident from Fig. 15 which settling time is less than 5.65µs which provides fast settling time in compare with previous works. Line transient response is demonstrated in Fig. 16. As it is evident that the maximum variations at the LDO output are less than 7.4mV under loading condition of 50mA with the step voltage source from 1.8V to 2.2V with 500ns rise/fall
Efficiency increases due to low energy consumption 3. It provide battery backup for about one hour 7.2 Application 1. To reduce cost, size and weight of a power supply 2. CCTV cameras, TV’s, monitor, PC’s, laptop and camcorder power packs, printers, fax machine, VCRs, portable CD players, microelectronics based devices in automotive, computing, communication, consumer electronics and industrial applications use SMPS. Controllable output power analysis of SMPS using PWM technique for DC appliances Sigma, Matar Page XXXVII CHAPTER 8 CONCLUSION Controllable output power analysis of SMPS using PWM technique for DC appliances Sigma, Matar Page XXXVIII Suitable components were selected and tested for desired performance.
In the process roasting there is a change in some of the CuFeS2 to copper oxide remove some of the sulphur as sulphur dioxide. This is done by heating the concentrated chalcopyrite ore from froth floatation. It is heated to between 500 °C and 700 °C in air. From the roaster a product is formed called a calcine, which is a solid mixture containing oxides, sulphides and sulphates. SO2(g) is released from the copper minerals. This is a important and valuable by product of the process and helps to offset the costs of copper
{N} and {M} are the generalised stresses can can be expressed as membrane strains and curvatures by using the laminar stress-strain relationship and Love Kirchhoff hypothesis.
A gate turn off current greater than 2 Amps is necessary to drive either parallel or back-to-back MOSFETs and maintain fast turn off time. The fast turn off time is essential to prevent reverse current to the supply after fast turn off threshold detection.
Because of their small size, ISFETs can be miniature diagnosis devices, allowing low sample consumption combined with a rapid response. ISFETs make the selective detection of certain ions in complex samples more efficient and can open
Nowadays, Silicon CMOS is the ultimate winner for the high-speed and/or low power computations and logic race. It is the pillar of the semiconductor industry and the main driver for device scaling. The lithographic process advancement and the integration of new materials (like, SiGe and HfO) [2] with the conventional CMOS had helped in overcoming the key challenge of preserving the low power and high performance which was very hard to maintain due to aggressive scaling [3]–[9].
What catches the eye most when looking at a potential new surfboard is usually the overall shape, length, or even the color and graphics. Less attention is given to a key component: the fin. But this small appendage is responsible for much of your new board's performance.
The use of nano-materials and extreme precision micro-engineering has the potential for great improvement in the world of electronics and information technology by providing smaller, faster, and more powerful computers and this has been at the forefront of the nanotechnology commercialization . Great examples of how nanotechnology is currently being used in these fields are products such as processors, data storage, and memory components made with nano-materials, TVs, monitors and even smartphone screens that use organic light-emitting diodes (OLED), and waterproof electronics such as smartphones due to the application of nano-coatings
The mote’s size makes energy management a key component. The circuit will contain circuits, a temperature sensor, and A/D converter, microprocessor, SRAM, communications circuits, and power control circuits. Sensors work together with the IC, which will operate from a power source integrated with the platform.
The properties (width and length) of the nmos and pmos are given using ‘Edit Properties’.
As the popularity of cell phones continues to increase, continually having a charged device becomes of utmost importance. In order to fulfill this need, designers have created portable chargers, such as the Siva Cycle Atom. The device claims to be 80% efficient and seems to be a viable solution that could be purchased by many individuals in a commercial setting.
In this work, 8-Bit ADC consecutive general register (SAR ADC) estimate. The main purpose is to reduce the power consumption of the micro-w. The proposed SAR ADC can be considered at the transistor level to 0.18 micron CMOS process. From this simulation, ADC reaches the entire energy use for micro 790.37w power supply.
We have now discussed the two extremes in electronic materials; a conductor, and an insulator we will now move to a material that lies in between these two, a semiconductor. The