A thin electronic component with a surface area of 950 cm2 is cooled by having a heat sink attached on its top surface. The thermal contact conductance of the interface between the electronic component and the heat sink is 25,000 W/m2∙K. According to the manufacturer, the heat sink has combined convection and radiation thermal resistance of 1.3 K/W. If the electronic component dissipates 45 W of heat through the heat sink in a surrounding temperature of 30°C, determine the temperature of the electronic component. Does the contact resistance at the interface of the electronic component and the heat sink play a significant role in the heat dissipation?
Energy transfer
The flow of energy from one region to another region is referred to as energy transfer. Since energy is quantitative; it must be transferred to a body or a material to work or to heat the system.
Molar Specific Heat
Heat capacity is the amount of heat energy absorbed or released by a chemical substance per the change in temperature of that substance. The change in heat is also called enthalpy. The SI unit of heat capacity is Joules per Kelvin, which is (J K-1)
Thermal Properties of Matter
Thermal energy is described as one of the form of heat energy which flows from one body of higher temperature to the other with the lower temperature when these two bodies are placed in contact to each other. Heat is described as the form of energy which is transferred between the two systems or in between the systems and their surrounding by the virtue of difference in temperature. Calorimetry is that branch of science which helps in measuring the changes which are taking place in the heat energy of a given body.
A thin electronic component with a surface area
of 950 cm2 is cooled by having a heat sink attached on its
top surface. The thermal contact
between the electronic component and the heat sink is
25,000 W/m2∙K. According to the manufacturer, the heat sink
has combined
1.3 K/W. If the electronic component dissipates 45 W of heat
through the heat sink in a surrounding temperature of 30°C,
determine the temperature of the electronic component. Does
the contact resistance at the interface of the electronic component
and the heat sink play a significant role in the heat
dissipation?
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