A thin, disk-shaped silicon water of diameter 20cm on a production line must be maintained at a temperature of 100 degree celcius. The wafer loses heat to the room byconvection and radation from its upper surface, while heat is supplied at a constant flux from below. The surrounding air is at 20 degree C while all surrounding surfaces can be approximated to be isothermal at a temperature of 15 degree C. The wafer to air heat transfer coefficient is 30W/m^2-K and the emisivity of the wafer’s surface (approximate as graybodies) is 0.85. How much heat must be applied to the wafer at the unit of W?

Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)
8th Edition
ISBN:9781305387102
Author:Kreith, Frank; Manglik, Raj M.
Publisher:Kreith, Frank; Manglik, Raj M.
Chapter1: Basic Modes Of Heat Transfer
Section: Chapter Questions
Problem 1.18P: The heat transfer coefficient for a gas flowing over a thin float plate 3-m long and 0.3-m wide...
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A thin, disk-shaped silicon water of diameter 20cm on a production line must be maintained at a temperature of 100 degree celcius. The wafer loses heat to the room byconvection and radation from its upper surface, while heat is supplied at a constant flux from below. The surrounding air is at 20 degree C while all surrounding surfaces can be approximated to be isothermal at a temperature of 15 degree C. The wafer to air heat transfer coefficient is 30W/m^2-K and the emisivity of the wafer’s surface (approximate as graybodies) is 0.85. How much heat must be applied to the wafer at the unit of W?
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