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Does the C2F6 flow rate affect average etch uniformity? Use = 0.05. (b) What is the P-value for the test in part (a)?

Principles of Instrumental Analysis

7th Edition

ISBN:9781305577213

Author:Douglas A. Skoog, F. James Holler, Stanley R. Crouch

Publisher:Douglas A. Skoog, F. James Holler, Stanley R. Crouch

Chapter21: Surface Characterization By Spectroscopy And Microscopy

Section: Chapter Questions

Problem 21.10QAP

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Question

An article in Solid State Technology, "Orthogonal Design of Process Optimization and Its Application to Plasma Etching" by G.Z. Yin and D.W. Jillie (May, 1987) describes an experiment to determine the effect of C₂F₆ flow rate on the uniformity of the etch on a silicon wafer used in integrated circuit manufacturing. Data for two flow rates are as follows:

C₂F₆	Uniformity Observation
(SCCM)	1	2	3	4	5	6
125	2.7	4.6	2.6	3.0	3.2	3.8
200	4.6	3.4	2.9	3.5	4.1	5.1

C₂F₆	Uniformity Observation
(SCCM)	1	2	3	4	5	6
125	2.7	4.6	2.6	3.0	3.2	3.8
200	4.6	3.4	2.9	3.5	4.1	5.1

(a) Does the C₂F₆ flow rate affect average etch uniformity? Use = 0.05.

(b) What is the P-value for the test in part (a)?

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